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| 脉冲周期和糖精添加剂对电沉积Ni镀层微观结构的影响 |
| 郑良福, 彭晓, 王福会 |
| 中国科学院金属研究所金属腐蚀与防护国家重点实验室 沈阳 110016 |
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| Effect of Pulse Period and Saccharin Additive on Microstructure of Ni Electrodeposits |
| ZHENG Liangfu, PENG Xiao, WANG Fuhui |
| State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 |
引用本文:
郑良福 彭晓 王福会. 脉冲周期和糖精添加剂对电沉积Ni镀层微观结构的影响[J]. 材料研究学报, 2010, 24(5): 501-507.
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Effect of Pulse Period and Saccharin Additive on Microstructure of Ni Electrodeposits[J]. Chin J Mater Res, 2010, 24(5): 501-507.
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