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Chin J Mater Res  2005, Vol. 19 Issue (1): 78-83    DOI:
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The die swelling of polycarbosilane and the profile degree of Y-shaped SiC fibers
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1.国防科技大学; 2.东华大学
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;. The die swelling of polycarbosilane and the profile degree of Y-shaped SiC fibers. Chin J Mater Res, 2005, 19(1): 78-83.

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Abstract  The die--swell mechanism of polycarbosilane(PCS) melt for a spinneret with Y--shaped orifice and the effect of die swelling of PCS on the profile degree ($PD$) of Y--shaped SiC were investigated. For a spinneret with circular holes, the die--swell ratio was in the range of 1.02$\sim$1.15, while for a spinneret with Y--shaped orifices, the ratio is 1.02$\sim$1.43. The die--swell ratio for a spinneret with Y--shaped orifices was about 15\% higher than that with circular holes in the same forming condition. The asymmetric distribution of shear stress in the circumference of the Y--shaped orifice and the different shear stress in the orifice profiles were the fundamental reasons for the increase of the die--swell ratio for the Y--shaped orifice. In comparison with the $PD$ of the orifice, there was a reduction of 10\%$\sim$20\% in the $PD$ of the fibers.
Key words:  inorganic nonmetallic material      die-swell ratio      Y-shaped SiC fibers      profile degree      
Received:  17 March 2005     
ZTFLH:  TB321  
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https://www.cjmr.org/EN/     OR     https://www.cjmr.org/EN/Y2005/V19/I1/78

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