Mechanism of lowering the sintering temperature of Al2O3 ceramic by the addition of CuO–TiO2 (I)

Chin J Mater Res

2009, Vol. 23

Issue (5): 534-540 DOI:

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Mechanism of lowering the sintering temperature of Al₂O₃ ceramic by the addition of CuO–TiO₂(I)

ZHANG Bin¹; WANG Huanping¹; MA Hongping²; XU Shiqing¹; LI Denghao¹; ZHOU Guangmiao¹

1.College of Materials Science and Engineering; China Jiliang University; Hangzhou 310018
2.School of Mechanical & Automotive Engineering; Zhejiang University of Science and Technology; Hangzhou 310012

Cite this article:

ZHANG Bin WANG Huanping MA Hongping XU Shiqing LI Denghao ZHOU Guangmiao. Mechanism of lowering the sintering temperature of Al₂O₃ ceramic by the addition of CuO–TiO₂(I). Chin J Mater Res, 2009, 23(5): 534-540.

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Abstract

The effects of CuO and TiO₂additives on the sintering behavior, microstructure, phase composition and the mechanism of lowering the sintering temperature of Al₂O₃ ceramics have been investigated. It was difficult to take place for the combination reaction between CuO and TiO₂, and the sintering densification of alumina ceramic was greatly enhanced by the addition of CuO as a liquid phase sintering aid and TiO₂ as a solid–state reaction sintering aid. The reaction between TiO₂and Al₂O₃resulted in the solid–state reaction sintering process, which was more effective to lower the sintering temperature of Al₂O₃ceramic than the liquid phase sintering process by the addition of CuO. Adding 0.025 mol CuO–TiO₂(the molar ratio of TiO₂ to CuO–TiO₂was 0.80) into 50 g Al₂O₃powders, the alumina ceramic achieved compact structure at 1250 and reached above 98% of the theoretical density.

Key words: inorganic non–metallic materials Al₂O₃ sintering additive liquid phase sintering solid–state reaction sintering

Received: 18 February 2009

ZTFLH:	TQ174
	TB321

Fund:

Supported by the Program for New Century Excellent Talents in University No.NCET–07–0786, and the Science Technology of Zhejiang Province Nos.2008C21053 and 2008C21054.

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https://www.cjmr.org/EN/ OR https://www.cjmr.org/EN/Y2009/V23/I5/534

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