|
Cite this article:
. . Chin J Mater Res, 2003, 17(1): 1-9.
|
|
|
|
|
Received: 01 January 1900
|
1 J.F.Patrick,L.Fevre,Environmental issues in power elec- tronics(Lead Free),in:Applied Power Electronics Con- ference and Exposition(Texas,USA,10-14 March 2002) p.1,121-125
2 Y.Fukuda,M.G.Pecht,K.Fukuda,S.Fukuda,Lead-free soldering in the Japanese Electronics Industry,IEEE Transaction on Components and Packaging Technologies, 3(26),616(2003)
3 B.Trumble,Get the lead out!,IEEE Spectrum,5,55(1998)
4 ZHANG Xinping,WANG Hongwei,HUA Zigui,The com- position optimization of solders based on the studies of surface-active behavior of microadding elements,Journal of Xi'an Jiaotong University,28(4),14(1994) (张新平，王红卫，华自圭，基于微量添加元素表面活性研究的钎料成分优化，西安交通大学学报，28(4)，14(1994))
5 X.P.Zhang,H.W.Wang,Y.W.Shi,Influence of elements Bi,Ag and In on surface tension and processing perfor- mance of tin-lead based solders,J.Mater.Sci-Mater.EL, 15,511(2004)
6 U.R.Kattner,W.J.Boettinger,On the Sn-Bi-Ag ternary phase diagram,J.Elec.Mater.,23,603(1994)
7 X.P.Zhang,C.B.Yu,S.Shrestha,L.Dorn,Creep and fatigue behaviors of the lead-free Sn-Ag-Cu-Bi and Sn60Pb40 solder interconnections at elevated tempera- tures,J.Mater.Sci-Mater.EL.,18,665(2007)
8 A.Grusd,Integrity of solder joints from lead-free solder paste,in:National Electronic Packaging and Production Conference Proceedings of the Technical Program (West and East),1,212-221(1999)
9 Y.Fukuda,P.Casey,M.Pecht,Evaluation of selected Japanese lead-free consumer electronics,Trans.Elec. Pack.Manufac.,26(4),305(2003)
10 Zs.Illyefalvi-Vitéz,J.Pinkola,G.Harsányi, Cs.Dominkovics,B.Illés,L.Tersztyánszky,Present status of transition to Pb-free soldering,Electronics Tech- nology:Meeting the Challenges of Electronics Technology Progress,28th International Spring Seminar,19-20 May 2005,88-93
11 J.H.L.Pang,B.S.Xiong,T.H.Low,Creep and fatigue char- acterization of lead free 95.5Sn-3.8Ag-0.TCu solder,in: Proceedings of 54th ECTC,Vol.2,(Las Vegas,USA,1- 4 June 2004) p.1333
12 A.H.Yanagawa,E.Ide,K.F.Kobayashi,Joint strength and interfacial microstructure between Sn-Ag-Cu and Sn-Zn- Bi solders and Cu substrate,Sci.Tech.Adv.Mater.,5, 267(2004)
13 LI Bo,SHI Yaowu,XIA Zhidong,LEI Yongping,GUO Fu,Research on the SnAgCu lead free solder with minute amount rare earth elements,Electronics Process Technol- ogy,25(5),193(2004) (李擘，史耀武，夏志东，雷永平，郭福，添加微量稀土元素的SnAgCu无铅钎料的研究，电子工艺技术，25(5)，193(2004))
14 D.Suraski,K.Seelig,The current status of lead-free sol- der alloys,IEEE Trans.Elec.Pack.Manufac.,24(4), 244(2001)
15 S.Wiese,K.J.Wolter,Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders,Microelectronics Reliability,44(12),1923(2004)
16 ZHANG Xinpin,YU Chuangbao,ZHANG Yupeng,ZHU min,Creep-resistance performance of two lead-free solders and comparison with Sn60Pb40 solder,Transactions of the China Welding Institution,28(2),1(2007) (张新平，于传宝，张宇鹏，朱敏，两种无铅钎料的抗蠕变性能及与Sn60Pb40钎料的比较，焊接学报，28(2)，1(2007))
17 X.P.Zhang,L.M.Yin,C.B.Yu,Thermal creep and fracture behaviors of the lead-free Sn-Ag-Cu-Bi solder interconnec- tions under different stress levels,J.Mater.Sci-Mater. EL.,2007(in press,online on 30 June 2007)
18 C.M.L.Wu,A promising lead-free material for flip- chip bumps:Sn-Cu-RE,4th International Conference on Advanced Semiconductor Devices and Microsystems, (Smolenice Castle,Slovakia,14-16 October 2002) p.17-26
19 Q.Yu,T.Kiga,M.Takeuchi,K.Toi,Y.Katou,CSP mount- ing reliability with Sn-Zn-Bi in JIEP project,Proceedings of 2nd International Symposium on Environmentally Con- scious Design and Inverse Manufacturing,(Tokyo,Japan, 11-15 December 2001)p.1059-1063
20 J.M.Song,G.F.Lan,T.S.Lui,L.H.Chen,Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder al- loys,Scripta Materialia,48,1047(2003)
21 WU Wenyun,QIU Xiaoming,YIN Shiqiang,SUN Daqian, LI Minggao,Influence of Bi,Ag on microstructure and properties of Sn-Zn lead-free solder,The Chinese Journal of Nonferrous Metals,16(1),158(2006) (吴文云，邱小明，殷世强，孙大谦，李明高，Bi、Ag对Sn- Zn无铅钎料性能与组织的影响，中国有色金属学报，16(1)，158(2006))
22 YU Daquan,ZHAO Jie,WANG Lai,Wetting properties of Sn-9Zn solder alloy with trace rare earth elements,The Chinese Journal of Nonferrous Metals,13(4),1001(2003) (于大全，赵杰，王来，稀土元素对Sn-9Zn合金润湿性能的影响，中国有色金属学报，13(4)，1001(2003))
23 ZHANG Wendian,Applied Surface Mount Technology (Beijing,Publishing House of Electronics Industry,2006) p.197 (张文典，实用表面组装技术(北京，电子工业出版社，2006) p．197)
24 R.K.Shiue,L.W.Tsay,C.L.Lin,J.L.Ou,A study of Sn-Bi- Ag-(In)lead-free solders,J.Mater.Sci.,38,1269(2003)
25 J.H.Lau,C.P.Wong,N.C.Le,S.W.R.Lee,Electron- ics Manufacturing with Lead-free,Halogen-free & Conductive-Adhensive Materials(Beijing,Chemical In- dustry Press,2005) (J．H．Lau，C．P．Wong，N．C．Le，s．W．R．Lee，电子制造技术-利用无铅、无卤素和导电胶材料，姜岩峰，张常年译(北京，化学工业出版社，2005))
26 N.C.Lee,Flux technology for lead-free alloys and its im- pact on cleaning,27th Annual IEEE/CPMT/SEMI In- ternational Electronics Manufacturing Technology Sym- posium,San Jose,CA USA,17-18 July,2002,IEMT 2002, 316-322
27 WANG Suli,LEI Yongping,XIA Zhiadong,SHI Yaowu, LI Xiaoyan,Development of no-clean flux for lead-free sol- der,Electronics Process Technology,25(4),147(2004) (王素丽，雷永平，夏志东，史耀武，李晓延，无铅钎料用免清洗助焊剂的研制，电子工艺技术，25(4)，147(2004))
28 K.N.Tu,J.C.M.Li,Spontaneous whisker growth on lead- free solder finishes,Mater.Sci.Eng.,A409,131(2005)
29 Y.Fukuda,M.Osterman,M.Pecht,The impact of electri- cal current,mechanical bending,and thermal annealing on tin whisker growth.Microelectronics Reliability,47, 88(2007)
30 J.Brusse,Tin whisker observations on pure tin-plated ceramic chip capacitors,AESF SUR/FIN Proceedings,( Navy Pier,Chicago,USA,24-27 June,2002)p.45-61
31 I.K.Huit,B.Ralph,A study of the initiation of the tomb- stoning effect on leadless chips,Int.J.Mach.Tool.Man- ufac.,35,1251(1995)
32 K.Zeng,R.Stierman,T.C.Chiu,D.Edwards,K.Ano, K.N.Tu,Kirkendall void formation in eutectic SnPb solder joint on bare Cu and its effect on joint reliability,J.Appl. Phys.,97,024508(2005)
33 T.R.Homa,Cracking of electronic packaging joints due to creep-fatigue,in:Proceedings of ASM's 3rd Conference on Electronic Packaging and Corrosion in Microelectron- ics,(Minneapolis,Minnesota,28-30 April 1987)p.209-216
34 K.Zeng,K.N.Tu,Six cases of reliability study of Pb-free solder joints in electronic packing technology,Mater.Sci. Eng.,R38,55(2002)
35 C.Chen,S.W.Liang,Electromigration issues in lead-free solder joints,J.Mater.Sci-Mater.EL.,18,259(2007)
36 K.N.Tu,K.Zeng,Tin-lead(SnPb)solder reaction in flip chip technology,Mater.Sci.Eng.,R34,1(2001)
37 M.Li,F.Zhang,W.T.Chen,K.Zeng,K.N.Tu,H.Balkan, P.Elenius,Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films,J. Mater.Reseat.,17,1612(2001)
38 H.T.Chen,C.Q.Wang,M.Y.Li,D.W.Tian,Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu sub- strate during aging,Mater.Lett.,60,1669(2006)
39 H.T.Chen,C.Q.Wang,M.Y.Li,Numerical and experimen- tal analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling,Microelectronics Reliability,46, 1348(2006)
40 B.Ebersberger,R.Bauer,L.Alexa,Reliability of lead free SnAg solder bumps:Influence of electromigration and temperature,Proceedings of 2005 IEEE/ECTC,2005, 1407-1415
41 K.J.Puttlitz,G.T.Galyon,Impact of the ROHS Directive on high-performance electronic systems PartⅡ:Key re- liability issues preventing the implementation of lead-free solders,J.Mater.Sci-Mater.EL.,18347(2007)
42 R.K.Kirschman,W.M.Sokolowski,E.A.Kolawa,Die at- tachment for -120℃to +20℃thermal cycling of mi- croelectronics for future mars rovers-An overview,J.Elec- tronic Packaging,123,105(2001)
43 A.C.Keeney,D.M.Lee,J.S.Lehtonen,A.S.Francomacaro, Indium bump bonding for cryogenic applications,Proceed- ings of SPIE,4587,106(2001)
44 E.Suhir,The future of microelectronics and photonics and the role of mechanics and materials,J.Electronic Packag- ing,120,1(1998)
45 R.R.Tummala,Fundamentals of Microsystems Packaging (McGraw-Hill,New York,2001)
46 H.Hentzell,M.Olson,G.Arvidsson,Optical packaging technology-the next innovations,in:14th European Mi- croelectronics and Packaging Conference & Exhibition (Friedrichshafen,Germany,23-25 June 2003)p.1-5
47 C.C.Lee,S.Choe,Fluxless In-Sn bonding process at 140℃,Mater.Sci.Eng.,A333(1-2),45(2002) |
| No Suggested Reading articles found! |
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
| |
Shared |
|
|
|
|
| |
Discussed |
|
|
|
|
