Chin J Mater Res  1992, Vol. 6 Issue (3): 209-213    DOI:

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SYNTHESIS OF Cu ULTRAFINE PARTICLES USING GAS EVAPORATION METHOD

XU Jian;SUN Xiukui;CHEN Wenxiu;FAN Xueshu;WEI Wenduo(State Key Laboratory of RSA;Institute of Metal Research;Academia Sinica)

XU Jian;SUN Xiukui;CHEN Wenxiu;FAN Xueshu;WEI Wenduo(State Key Laboratory of RSA;Institute of Metal Research;Academia Sinica). SYNTHESIS OF Cu ULTRAFINE PARTICLES USING GAS EVAPORATION METHOD. Chin J Mater Res, 1992, 6(3): 209-213.

Abstract References Related Articles Recommended Metrics Download:  PDF(1055KB)  Export:  BibTeX | EndNote (RIS)       Abstract  In this work the method,which is that metal was evaporated and its vapour wascondensed under inert atmosphere,is used to synthesize Cu ultrafine particles with nanometersize.The structure and the morphology of Cu ultrafine particles are analyzed by means Key words:  gas evaporation      copper      ultrafine particle      particle size      Received:  25 June 1992      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.cjmr.org/EN/     OR     https://www.cjmr.org/EN/Y1992/V6/I3/209 1 Kimoto K,Kamiya Y,Nonoyama M et al.Jap J Appl Phys,1963;2:702 2 Birringer R,Gleiter H,Klein H-P et al.Phys Lett,1984;102A:365 3 范雄.X 射线金属学.北京:机械工业出版社,1981:141 4 Uyeda R.J Crystal Growth,1974;24/25:69 5 Wada N.Jap J Appl Phys,1968;7:1287 6 Granquist C G,Bahrman R A.J Appl Phys 1976;47:2200 7 Kaito C.Jap J Appi Phys,1985;24:261 [1] XIE Donghang, PAN Ran, ZHU Shize, WANG Dong, LIU Zhenyu, ZAN Yuning, XIAO Bolv, MA Zongyi. Effect of Reinforced Particle Size on the Microstructure and Tensile Properties of B4C/Al-Zn-Mg-Cu Composites[J]. 材料研究学报, 2023, 37(10): 731-738. [2] XIAO Han, ZHOU Yuhang, CHEN Lei, ZHANG Xiongchao, CUI Yunxin, XIONG Chi. Effect of Isothermal Time on Microstructure and Properties of Thixo-extruded Tin Bronze Bushing[J]. 材料研究学报, 2022, 36(9): 641-648. [3] ZONG Ping, LI Shiwei, CHEN Hong, MIAO Sainan, ZHANG Hui, LI Chao. In-situ Thermolysis Preparation of Carbon Capsulated Nano-copper and Its Stability[J]. 材料研究学报, 2022, 36(11): 829-836. [4] LI Jianzhong, ZHU Boxuan, WANG Zhenyu, ZHAO Jing, FAN Lianhui, YANG Ke. Preparation and Properties of Copper-carrying Polydopamine Coating on Ureteral Stent[J]. 材料研究学报, 2022, 36(10): 721-729. [5] YANG Yana, CHEN Wenge, XUE Yuanlin. Interficial Bonding within Cu-based Composites Reinforced with TiC- or Ni-coated Carbon Fiber[J]. 材料研究学报, 2021, 35(6): 467-473. [6] YAO Xiayan, ZHAO Yunyun, WANG Junhui, NIU Yongsheng, LU Xingwu. Effect of Cyclical Flow Velocity on Magnetized Copper Electrolysis Process[J]. 材料研究学报, 2020, 34(5): 392-400. [7] GU Wei, ZHANG Zhijian, YANG Jiaquan. Effect of Preparation Process on Magnetic Properties of Amorphous Magnetic Powder Cores[J]. 材料研究学报, 2020, 34(4): 291-298. [8] LU Jianhong, DENG Xiaomei, YAN Jianhui, TU Jiguo, WANG Mingyong, JIAO Shuqiang. Effect of PEG6000 on Electroless Copper in Dual-Ligands System[J]. 材料研究学报, 2019, 33(9): 666-672. [9] Tao MA,Huirong LI,Jianxin GAO,Yungang LI. Diffusion Behavior of Cu in Carbon Steel and Its Influence on Corrosion Resistance of Carbon Steel[J]. 材料研究学报, 2019, 33(3): 225-231. [10] Qiaomu LIU,Jie WU,Yulong CHEN,Qianming CHEN,Huiping PEI,Lei XU. Effect of Temperature and Powder Particle Size on Mechanical Properties and Microstructure of PM Ti2AlNb Alloy Prepared via Hot Isostatic Pressing[J]. 材料研究学报, 2019, 33(3): 161-169. [11] Limei SUN, Suriguga LI, Lele SHI, Yijia ZHANG. Effect of Cu on Electrocatalytic Oxidation of Ethanol by Catalyst Pdx-Cu/C[J]. 材料研究学报, 2018, 32(9): 669-674. [12] Bo WU, Xiaoyun ZHU, Mei CAO, Jinming LONG. Preparation and Properties of High Density and High Coverage Silver-coated Copper Powder[J]. 材料研究学报, 2018, 32(10): 775-781. [13] Zebang CHEN, Han XIAO, Naiyong LI, Rongfeng ZHOU, Dehong LU, Rong ZHOU. Effect of Extrusion Rate on Microstructure and Mechanical Property of Copper Alloy Prepared by Rheological Squeeze Casting[J]. 材料研究学报, 2018, 32(1): 73-80. [14] Xiaoqiang MA,Xiaoyun ZHU,Jinming LONG,Mei CAO. Effect of Glass Powder on Performance of Copper Conductor Film Prepared via Sintering Cu-glass Paste[J]. 材料研究学报, 2017, 31(6): 472-480. [15] LI Jiajun, LIU Hao, ZUO Yonggang, BAI Yang, YUAN Hewei, HE Qiyu, JIANG Long, GUO Hui, SUN Zhenlu, CHEN Guangchao. Analysis of Adhesive Strength between Magnetron Sputtered Copper Films and Substrate[J]. 材料研究学报, 2016, 30(8): 634-640. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed