Effects of parameters of vibrating wavelike sloping plate process on microstructures of Al–6Si–2Mg alloy

Chin J Mater Res

2008, Vol. 22

Issue (6): 639-644 DOI:

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Effects of parameters of vibrating wavelike sloping plate process on microstructures of Al–6Si–2Mg alloy

XIE Fengguang^1†; GUAN Renguo²; WANG Chao²; LIU Xianghua¹

1.State Key Lab. of Rolling & Automation; Northeastern University; Shenyang 110004
2.Materials & Metallurgical College; Northeastern University; Shenyang 110004

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XIE Fengguang; GUAN Renguo; WANG Chao; LIU Xianghua. Effects of parameters of vibrating wavelike sloping plate process on microstructures of Al–6Si–2Mg alloy. Chin J Mater Res, 2008, 22(6): 639-644.

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Abstract

Effects of parameters of Vibrating Wavelike Sloping Plate process (VWSP) on solidification microstructures of Al–6Si–2Mg alloy were investigated. The results show that sloping angle and sloping plate length can affect the shear strength and shear time of the flow alloy on the sloping plate and thus influence alloy microstructure. When the casting temperature is in the range from 660℃ to 690 ℃, grain refining and spheroidization proceed with the decrease of casting temperature, the average grain size is 40 μm and the average grain roundness is 2.5. When the casting temperature is lower than 660℃, dendrite coarsening appears. The vibrating of the sloping plate can lead the nucleus forming on the sloping plate surface to escape off the sloping plate and disperse in the melt, which not only can effectively avoid grain connecting and solidification shell happening but also can improve the nucleation rate and refine microstructure. With the increase of vibration frequency, grain roundness decreases first and then increases, when the vibration frequency is in the range from 50 Hz to 60 Hz, the grain roundness reaches the minimum value. Wavelike sloping plate surface had a stirring function on the flowing alloy, which improved the shear strength in the alloy and caused grains became finer and more round.

Key words: Wavelike sloping plate;Vibrating;Semisolid;Solidification microstructure

Received: 03 June 2008

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https://www.cjmr.org/EN/ OR https://www.cjmr.org/EN/Y2008/V22/I6/639

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