THE MICROSTRUCTURE AND ROOM TEMPERATURE DUCTILITY OF RAPIDLY SOLIDIFIED(Ni, Fe)Al INTERMETALLICS

Chin J Mater Res

1996, Vol. 10

Issue (2): 130-134 DOI:

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THE MICROSTRUCTURE AND ROOM TEMPERATURE DUCTILITY OF RAPIDLY SOLIDIFIED(Ni, Fe)Al INTERMETALLICS

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SUN Baode;CHE Xiaozhou; YANG Gengcang; ZHOU Yaohe(Shanghai Jiao Tong University)(Northwesten Polytechnic University)Correspondent:(Associate Professor; Department of Materials Engineering; Shanghai Jiao Tong University;Shanghai 200030). THE MICROSTRUCTURE AND ROOM TEMPERATURE DUCTILITY OF RAPIDLY SOLIDIFIED(Ni, Fe)Al INTERMETALLICS. Chin J Mater Res, 1996, 10(2): 130-134.

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Abstract The microstructure and bend ductility at room temperature of the (Ni, Fe)Al intermetallic compound were investigated by single roller rapid solidification technology. The results show that under rapid solidification Al-45Ni-5Fe formed equiaxed grains with

Key words: (Ni Fe)Al;rapid solidification; needle sub-grains;bend ductility

Received: 25 April 1996

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[1]	ZHU Xinhua; WANG Qun; MENG Zhongyan(Xi'an Jiaotong University) (Shanghai University Jiading Campus). PIEZOELECTRIC PROPERTIES OF Pb(Ni_(1/3)Nb_(2/3))O_3-PbZrO_3-PbTiO_3 TERNARY SOLID SOLUTIONS[J]. 材料研究学报, 1995, 9(4): 355-357.

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