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| EFFECT OF ANNEALING TEMPERATURES ON PHASES AND MICROSTRUCTURES OF Pt AND Pt / Ti BOTTOM ELECTRODES FOR FERROELECTRIC THIN FILMS |
| SONG Zhitang; REN Wei; WU Xiaoqing; ZHANG Liangying; YAO Xi (Xi'an Jiaotong University) |
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Cite this article:
SONG Zhitang; REN Wei; WU Xiaoqing; ZHANG Liangying; YAO Xi (Xi'an Jiaotong University). EFFECT OF ANNEALING TEMPERATURES ON PHASES AND MICROSTRUCTURES OF Pt AND Pt / Ti BOTTOM ELECTRODES FOR FERROELECTRIC THIN FILMS. Chin J Mater Res, 1997, 11(4): 363-368.
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Abstract Pt and Pt / Ti electrodes were dc-sputtered on Sio2 / Si substrates. As deposited samples were thermal treated at various temperatures by the common thermal annealing (CTA) process and the rapid thermal annealing (RTA) process respectively. Phase identifi
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Received: 25 August 1997
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| 1.Kyu Ho Park,Cha Yeon Kim,Young Woo Jeong.J.Mater.Res.10(7),1790(1995) |
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