材料研究学报  2013, Vol. 27 Issue (6): 597-604

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Ti/Al复合电极基体材料的界面扩散层*

张 瑾 竺培显 代建清 周生刚 曹 勇

(昆明理工大学材料科学与工程学院 昆明 650093)

Studies on Interface Diffusion Layer of Ti/Al Composite Electrode Substrate Materials

ZHANG Jin ZHU Peixian** DAI Jianqing ZHOU Shenggang CAO Yong

(Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093)

张 瑾,竺培显,代建清,周生刚,曹 勇. Ti/Al复合电极基体材料的界面扩散层*[J]. 材料研究学报, 2013, 27(6): 597-604.
. Studies on Interface Diffusion Layer of Ti/Al Composite Electrode Substrate Materials[J]. Chinese Journal of Materials Research, 2013, 27(6): 597-604.

摘要 相关文章 Metrics 全文: PDF(3323 KB)   摘要: 用固-固热压扩散焊接复合法制备Ti/Al复合电极, 通过SEM、EDS、四探针法及电化学测试等技术对样品的结构与性能进行表征, 与传统Ti电极对比研究了Ti/Al复合电极的性能。结果表明: 焊接温度为540℃、保温时间为90 min制备的Ti/Al复合界面为结构稳定、导电性能优异的TiAl3单一物相层。 此时复合电极的界面电阻最低, 电化学性能最佳。通过第一性原理计算出4种Ti/Al金属间化合物的生成焓大小的排序为Ti3Al< TiAl< TiAl2< TiAl3, 结合能的排序为Ti3Al< TiAl< TiAl2< TiAl3。从热力学角度解释了单一界面层扩散层TiAl3的生成机理, 从扩散动力学计算出Ti/Al界面扩散层的生长动力学方程。 Abstract： A comparative study of performance advantages was made between Ti/Al composite electrode and conventional Ti electrode. Ti/Al composite electrode was fabricated by hot-pressing diffusion compound method. And the microstructure and properties of the novel electrode substrate materials were investigated by SEM, EDS, four-probe method and electrochemical measurements. The results show that the single phase of TiAl3 formed in Ti/Al compound interface has stable structure and excellent electrical conductivity under the condition of 540℃ sintering temperature and 90min holding time. In this case, the composite electrode has the lowest interfacial resistance and the best electrochemical performance. In this paper first principles calculations were applied to study the formation enthalpy and binding energy of four kinds of Ti/Al intermetallic compounds. The order of formation enthalpy is as following: Ti3Al< TiAl< TiAl2< TiAl3; the order of binding energies is as following: Ti3Al< TiAl< TiAl2< TiAl3. The formation mechanism of single interface diffusion layer of TiAl3 was explained from the view of thermodynamics. And growth dynamics equation of interface diffusion layer is obtained by diffusion kinetics calculation.      ZTFLH:  分类号 TB331   基金资助:国家自然科学基金51264025 和国家高技术研究发展计划2009AA03Z512资助项目。 服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 44.8K 链接本文: https://www.cjmr.org/CN/      或      https://www.cjmr.org/CN/Y2013/V27/I6/597 No related articles found! Viewed Full text Abstract Cited   Shared      Discussed