还原氧化石墨烯铜基复合材料的耐腐蚀性能及其机理

姜兴国, 沈文卓, 杨涛, 张佳利, 钟民, 曹贺, 郭守武

Enhancing Effect and Mechanism of Reduced Graphene Oxide on the Corrosion Resistance of Copper-based Composites

JIANG Xingguo, SHEN Wenzhuo, YANG Tao, ZHANG Jiali, ZHONG Min, CAO He, GUO Shouwu

图2 Cu和Cu/rGO块体电化学蚀刻不同时间得到的Nyquist图、等效电路图、在3.5%的NaCl水溶液中蚀刻3 d后Cu和Cu/rGO块体表面的SEM照片

Fig.2 Nyquist plots of Cu and Cu/rGO bulk electrochemically etched for different time (a, b), equivalent electrical circuit (c), and SEM images of the surfaces of Cu and Cu/rGO bulk after being etched in 3.5%NaCl aqueous solution for 3 d (d, e)