使用Ni中间层SPS扩散连接金刚石/铜复合材料界面的导热性能
Microstructure and Thermal Conductivity of Interface within Composite of Diamond Particulates/Cu Fabricated via Spark Plasma Sintering Technique with Thin Ni-foil as Interlayer
使用Ni中间层SPS扩散连接金刚石/铜复合材料界面的导热性能 |
| 胡道春, 王蕾, 见小琪, 陈明和, 周颖 |
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Microstructure and Thermal Conductivity of Interface within Composite of Diamond Particulates/Cu Fabricated via Spark Plasma Sintering Technique with Thin Ni-foil as Interlayer |
| HU Daochun, WANG Lei, JIAN Xiaoqi, CHEN Minghe, ZHOU Ying |
| 图10 界面的模型结构示意图 |
| Fig.10 Interface model structure diagram (a) diamond/Cu, (b) diamond/Ni, (c) Cu/Ni |
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