使用Ni中间层SPS扩散连接金刚石/铜复合材料界面的导热性能

胡道春, 王蕾, 见小琪, 陈明和, 周颖

Microstructure and Thermal Conductivity of Interface within Composite of Diamond Particulates/Cu Fabricated via Spark Plasma Sintering Technique with Thin Ni-foil as Interlayer

HU Daochun, WANG Lei, JIAN Xiaoqi, CHEN Minghe, ZHOU Ying

图6 不同保压时间镍中间层的微观形貌和EDS元素

Fig.6 Microscopic morphology and EDS elemental analysis of nickel interlayer at different test times (a, b) 30 min, (c, d) 90 min