使用Ni中间层SPS扩散连接金刚石/铜复合材料界面的导热性能

胡道春, 王蕾, 见小琪, 陈明和, 周颖

Microstructure and Thermal Conductivity of Interface within Composite of Diamond Particulates/Cu Fabricated via Spark Plasma Sintering Technique with Thin Ni-foil as Interlayer

HU Daochun, WANG Lei, JIAN Xiaoqi, CHEN Minghe, ZHOU Ying

图2 试样摆放位置的示意图

Fig.2 Sample placement position