β-SiC半导体器件在滑动摩擦中材料去除行为的纳观分析

施渊吉, 程诚, 张海涛, 胡道春, 陈晶晶, 黎军顽

Nanoscale Analysis of Material Removal Behavior of β-SiC Semiconductor Devices during Sliding Wear

SHI Yuanji, CHENG Cheng, ZHANG Haitao, HU Daochun, CHEN Jingjing, LI Junwan

图9 滑动摩擦参数对β-SiC径向分布函数影响

Fig.9 Influence of sliding friction parameters on the radial distribution function of β-SiC (a) indentation depth effect, (b) particle radius effect, (c) sliding speed effect, (d) temperature effect