β-SiC半导体器件在滑动摩擦中材料去除行为的纳观分析

施渊吉, 程诚, 张海涛, 胡道春, 陈晶晶, 黎军顽

Nanoscale Analysis of Material Removal Behavior of β-SiC Semiconductor Devices during Sliding Wear

SHI Yuanji, CHENG Cheng, ZHANG Haitao, HU Daochun, CHEN Jingjing, LI Junwan

图6 滑动摩擦参数对β-SiC微结构演化影响

Fig.6 Influence of sliding friction parameters on the microstructure evolution of β-SiC (a) effect of temperature on microstructure evolution, (b) effect of sliding speed on microstructure evolution, (c) effect of indentation depth on microstructure evolution, (d) effect of crystal plane on microstructure evolution