β-SiC半导体器件在滑动摩擦中材料去除行为的纳观分析

施渊吉, 程诚, 张海涛, 胡道春, 陈晶晶, 黎军顽

Nanoscale Analysis of Material Removal Behavior of β-SiC Semiconductor Devices during Sliding Wear

SHI Yuanji, CHENG Cheng, ZHANG Haitao, HU Daochun, CHEN Jingjing, LI Junwan

图4 滑动速度对β-SiC纳米磨损阶段的原子位移幅度和剪切变形的影响

Fig.4 Influence of sliding velocity on atomic displacement amplitude and shear deformation of β-SiC under nano-wear stage (a) effect of sliding speed on atomic displacement amplitude from top view, (b) effect of sliding speed on atomic displacement amplitude from back view, (c) effect of sliding speed on shear strain from back view