β-SiC半导体器件在滑动摩擦中材料去除行为的纳观分析

施渊吉, 程诚, 张海涛, 胡道春, 陈晶晶, 黎军顽

Nanoscale Analysis of Material Removal Behavior of β-SiC Semiconductor Devices during Sliding Wear

SHI Yuanji, CHENG Cheng, ZHANG Haitao, HU Daochun, CHEN Jingjing, LI Junwan

图2 滑动摩擦参数对β-SiC平均摩擦力影响

Fig.2 Influence of sliding friction parameters on friction force (a-d) and average friction force (e-h) for β-SiC material (a, e) effect of abrasive particle radius on friction force, (b, f) effect of indentation depth on friction force, (c, g) effect of temperature on friction force, (d, h) effect of crystal plane on friction force