6H-SiC纳米磨削亚表面损伤机理的分子动力学研究
耿瑞文, 杨志豇, 杨蔚华, 谢启明, 游津京, 李立军, 吴海华

Molecular Dynamics Simulation of Subsurface Damage of 6H-SiC Bulk Materials Induced by Grinding with Nano-sized Diamond Particles
GENG Ruiwen, YANG Zhijiang, YANG Weihua, XIE Qiming, YOU Jinjing, LI Lijun, WU Haihua
图8 不同磨削速度和磨粒尺寸条件下的最大Von Mises应力
Fig.8 Maximum Von Mises stress under different grinding speeds and abrasive grain sizes