6H-SiC纳米磨削亚表面损伤机理的分子动力学研究
Molecular Dynamics Simulation of Subsurface Damage of 6H-SiC Bulk Materials Induced by Grinding with Nano-sized Diamond Particles
6H-SiC纳米磨削亚表面损伤机理的分子动力学研究 |
| 耿瑞文, 杨志豇, 杨蔚华, 谢启明, 游津京, 李立军, 吴海华 |
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Molecular Dynamics Simulation of Subsurface Damage of 6H-SiC Bulk Materials Induced by Grinding with Nano-sized Diamond Particles |
| GENG Ruiwen, YANG Zhijiang, YANG Weihua, XIE Qiming, YOU Jinjing, LI Lijun, WU Haihua |
| 图6 径向分布函数：(a)不同纳米磨削阶段、(b)不同磨削速度、(c)不同磨粒尺寸 |
| Fig.6 Radial distribution function: (a) different grinding cutting stage, (b) different grinding speeds, (c) different abrasive grain sizes |
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