6H-SiC纳米磨削亚表面损伤机理的分子动力学研究

耿瑞文, 杨志豇, 杨蔚华, 谢启明, 游津京, 李立军, 吴海华

Molecular Dynamics Simulation of Subsurface Damage of 6H-SiC Bulk Materials Induced by Grinding with Nano-sized Diamond Particles

GENG Ruiwen, YANG Zhijiang, YANG Weihua, XIE Qiming, YOU Jinjing, LI Lijun, WU Haihua

图4 不同磨削速度和磨粒尺寸条件下6H-SiC工件的亚表面损伤深度

Fig.4 Subsurface damage depth of workpiece under different grinding speeds and abrasive grain sizes