低聚聚酰亚胺(SPI)改性的聚酰亚胺(PI)固化物的制备和性能
朱国豪, 陈平, 徐计雷, 孙慧敏

Preparation and Properties of Curd Polyimide Modified by Oligomeric Polyimide
ZHU Guohao, CHEN Ping, XU Jilei, SUN Huimin
表2 固化后SPI改性PI聚合物薄膜的热性能
Table 2 Thermal properties of cured PI polymer film modified by SPI (oC)
SampleDSCDMATGA
TgTgTd5%Td10%TmaxRw
SPI/PI-0382.03-556.23579.23580.6572.12
SPI/PI-5428.25430.61555.69577.16581.4875.21
SPI/PI-10440.89456.86547.01572.19584.4074.04
SPI/PI-15435.08459.80534.42565.14585.8172.94