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Room Temperature Work-Hardenning Behavior of a Novel Sandwich Sheet of Cu-Al Alloy with Gradient Structure Surfaces on Both Sides
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图2 梯度层的微观结构
Fig.2 Microstructure of gradient layer (a) KAM map of the depth ~300 μm depth, characterized by EBSD, (b) The GND distribution map with depth, calculated by the average KAM statistics in (a), (c~e) TEM bright field image of ~30 μm, ~153 μm, ~246 μm depth, respectively