偏压技术在金刚石薄膜制备中应用的进展
邵思武1, 郑宇亭1,2, 安康1,2, 黄亚博1, 陈良贤1, 刘金龙1, 魏俊俊1, 李成明1(
)
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Progress on Application of Bias Technology for Preparation of Diamond Films
SHAO Siwu1, ZHENG Yuting1,2, AN Kang1,2, HUANG Yabo1, CHEN Liangxian1, LIU Jinlong1, WEI Junjun1, LI Chengming1()
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图14. 未加偏压沉积UNCD/a-C薄膜的横截面照片和划痕照片以及在40 kHz偏压下沉积UNCD/a-C薄膜的横截面照片和)划痕照片[
Fig.14. Microscopic images of Cross-sectional (a) and scratch tracks of UNCD/a-C films deposited at un-bias (c) and cross-sectional (b) and scratch tracks of UNCD/a-C films deposited at bias frequency of 40 kHz[
