碳纤维表面溅射金属增强铜基复合材料的界面结合

杨雅娜, 陈文革, 薛元琳

Interficial Bonding within Cu-based Composites Reinforced with TiC- or Ni-coated Carbon Fiber

YANG Yana, CHEN Wenge, XUE Yuanlin

表2 碳纤维增强铜基复合材料的密度、相对密度、导电率和硬度

Table 2 Density, relative density, conductivity and hardness of carbon fiber reinforced copper matrix composites

Sample

Density

/g·cm^-3

Relative density/%

Conductivity/(%IACS)

Hardness/(HV)

Sputtering TiC carbon fiber/Cu

8.37

96.1

91.0

40.8

Sputtering Ni carbon fiber/Cu

8.37

95.8

79.7

38.8