电化学刻蚀参数对高阻厚壁宏孔硅阵列表面形貌的影响
安欢1,伍建春1,张仲1,王欢1,孙华2,展长勇1(
),邹宇1()
),邹宇1()
Effect of Electrochemical Etching Parameters on Surface Morphology of Thick-walled Macroporous Silicon Array
Huan AN1,Jianchun WU1,Zhong ZHANG1,Huan WANG1,Hua SUN2,Changyong ZHAN1(),Yu ZOU1()
),Yu ZOU1()
图1. 诱导坑的扫描电子显微镜照片和COMSOL模拟的诱导坑的三维模型
Fig.1. SEM image of the prefabricated pits (a) and 3D model of the prefabricated pit for COMSOL simulation (b)
