树枝状介孔氧化硅磨粒的制备和抛光性能

王婉莹,陈爱莲,马翔宇,蔡文杰,陈杨

Preparation and Polishing Performance of Dendritic Mesoporous Silica Particle Abrasives

Wanying WANG,Ailian CHEN,Xiangyu MA,Wenjie CAI,Yang CHEN

表1 抛光试验参数

Table 1 Experimental parameters of polishing tests

Polosher model TegraForce-1/TrgraPol-15* Pad model MD-Chem* Rotation speed of the head 120 r/min Down pressure 3.3 psi Rotation speed of the platen 90 r/min Slurry pH value 8.5** Flow rate of slurry 100 ml/min Polishging time 1 min Dimension of workpiece 2.0 cm×2.0 cm*** Solid content 1% (mass fraction)