TaN薄膜的等离子体增强原子层沉积及其抗Cu扩散性能
王永平,丁子君,朱宝,刘文军,丁士进(
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Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
Yongping WANG,Zijun DING,Bao ZHU,Wenjun LIU,Shijin DING()
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图6. 在不同温度生长的TaN薄膜(~2 nm)的表面形貌
Fig.6. Surface morphology of the ALD TaN films (~2 nm) deposited at different temperature
