TaN薄膜的等离子体增强原子层沉积及其抗Cu扩散性能
王永平,丁子君,朱宝,刘文军,丁士进()
Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
Yongping WANG,Zijun DING,Bao ZHU,Wenjun LIU,Shijin DING()

图5. 在不同温度生长的TaN薄膜的Ta 4f 和C 1s的XPS高分辨率谱

Fig.5. high-resolution XPS spectra of Ta 4f (a) and C 1s (b) of the films deposited at different