TaN薄膜的等离子体增强原子层沉积及其抗Cu扩散性能
王永平,丁子君,朱宝,刘文军,丁士进(
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Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
Yongping WANG,Zijun DING,Bao ZHU,Wenjun LIU,Shijin DING()
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图4. TaN薄膜的XPS的全谱随Ar+原位刻蚀时间的变化图
Fig.4. Evolution of the XPS survey spectrum of the TaN film as a function of Ar ion etching time
