磁控溅射铜膜与基底结合强度的分析研究*

李佳君, 刘浩, 左永刚, 白旸, 袁禾蔚, 何其宇, 姜龙, 郭辉, 孙振路, 陈广超

Analysis of Adhesive Strength between Magnetron Sputtered Copper Films and Substrate

LI Jiajun, LIU Hao, ZUO Yonggang, BAI Yang, YUAN Hewei, HE Qiyu, JIANG Long, GUO Hui, SUN Zhenlu, CHEN Guangchao

表2 铜膜在金刚石基底上的失效时间和超声法获得的膜基结合强度

Table 2 Failure time and ultrasonic adhesive strength of diamond substrates with copper films

Sample Polished Fine-grain Coarse-grain Damage starting time/s 360 - 2400 Lasting time/s Damage speed/mm2/s 3240 0.03 - - 1200 0.003 Adhesive strength/MPa 58.7 - 102.4