磁控溅射铜膜与基底结合强度的分析研究*

李佳君, 刘浩, 左永刚, 白旸, 袁禾蔚, 何其宇, 姜龙, 郭辉, 孙振路, 陈广超

Analysis of Adhesive Strength between Magnetron Sputtered Copper Films and Substrate

LI Jiajun, LIU Hao, ZUO Yonggang, BAI Yang, YUAN Hewei, HE Qiyu, JIANG Long, GUO Hui, SUN Zhenlu, CHEN Guangchao

表1 溅射参数及对应样品

Table 1 Parameters of sputtering of corresponding samples

Sample Si-1 Si-2 Si-3 Polished Fine-grain Coarse-grain Substrate Si Si Si Diamond Diamond Diamond Sputtering power/W 250 375 425 425 425 425 Pressure/Pa 1.5 1.5 1.5 1.5 1.5 1.5 Sputtering time/min 8 8 8 8 8 8