Cu和Sn对钎焊料4343Al合金组织性能的影响
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赵媛媛, 章桢彦, 靳丽, 董杰
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Effect of Cu and Sn Addition on Microstructure and Properties of Brazing Filler 4343 Al Alloy
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ZHAO Yuanyuan, ZHANG Zhenyan, JIN Li, DONG Jie
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| 表2 模拟钎焊后界面结合比例 |
| Table 2 Interface bonding ratio after simulated brazing |
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| Alloy | Holding temperature | Brazing temperature | | 610℃ | | 605℃ | 600℃ | 595℃ | 590℃ | 585℃ | 580℃ | | Cu0 | 79% | 48.2% | 15.7% | 2% | × | × | × | >610℃ | | Cu0.25 (4343) | 100% | 79.4% | 47.2% | 9.2% | 2% | × | × | 610℃ | | Cu0.6 | 100% | 100% | 100% | 87.3% | 61.7% | 11.5% | 0% | 600℃ | | Cu1.0 | 100% | 100% | 100% | 100% | 89.7% | 39.6% | 2.1% | 595℃ | | Sn0.1 | 100% | 91.4% | 81.3% | 0% | × | × | × | 610℃ | | Sn0.25 | 100% | 100% | 92% | 24.5% | 7% | × | × | 605℃ | | Sn0.5 | 100% | 100% | 100% | 100% | 72.5% | 29.7% | 10% | 595℃ | | Sn1.0 | 100% | 100% | 100% | 100% | 100% | 67.4% | 37.0% | 590℃ |
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