组分调制Cu/Ni多层膜的合金化及其合金化镀层的耐蚀特性

骆立立, 费敬银, 王磊, 林西华, 王少兰

Alloying of Compositionally Modulated Cu/Ni Multilayer Films and Corrosion Performance of Cu-Ni Alloy Coatings

LUO Lili, FEI Jingyin, WANG Lei, LIN Xihua, WANG Shaolan

表1 镀铜液和镀镍液的组分及工艺参数

Table 1 Copper and nickel baths used for the deposition of Cu/Ni CMMF

Composition and operating condition Copper bath Nickel bath CuSO45 H2O, gL-1 90 --- NiSO46 H2O, gL-1 --- 250 H2SO4 (98%), mgL-1 200 --- Tri-ammonium citrate, gL-1 --- 50 Ammonia solution (25%~28%), mLL-1 --- 110 T, ℃ 20~30 55~65 Ic, mAcm-2 10 10 Agitation Magnetic stirrer Magnetic stirrer Anode Copper Platinised titanium mesh