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Cor Sci Pro Tech  2009, Vol. 21 Issue (3): 347-249    DOI:
失效分析 Current Issue | Archive | Adv Search |
PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY
ZHU Hou-fei1; HUANG Wen-quan2; YANG Chao3; HAO Long1; GAN Fu-xing1、4

1School of Resource and Environmental Science;Wuhan University;Wuhan 430079;

2Anhui Vocational & Technical College of Industry & Trade;Huainan 232001;

3Department of Environment Supervision;Zhejiang Provinces Environmental Protection Science Design and Research Institute;Hangzhou 310007; 4State Key Laboratory for Corrosion and Protection;Shenyang 110016

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Abstract  

    The surface morphology and composition,microstructure,appearance,adhesion,hardness,antiabration ability,porosity ratio,solder ability and corrosion resistance of electroless Ni-P alloy plating on W-Cu alloy were investigated.The result indicates that the Ni-P alloy coating belongs to high phosphorus coating with P content 11.37 wt.% and it is amorphous in nature,and the anti-abrasion ability and hardness of W-Cu alloy was greatly improved by electroless Ni-P alloy plating.Meanwhile,the Ni-P alloy coating has a qualified adhesion with W-Cu alloy substrate with lower porosity ratio and good solderability and the deposit can offer fairly good protection to W-Cu alloy substrate in 3.5 wt.% NaCl solution,artificial sweat solut

Key words:  Cu alloy      electroless plating      Ni-P alloy      coating property     
Received:  12 March 2007     

TQ174.44

 
Corresponding Authors:  HAO Long     E-mail:  fxgan@whu.edu.cn

Cite this article: 

ZHU Hou-fei; HUANG Wen-quan; YANG Chao; HAO Long; GAN Fu-xing. PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY. Cor Sci Pro Tech, 2009, 21(3): 347-249.

URL: 

https://www.cspt.org.cn/EN/     OR     https://www.cspt.org.cn/EN/Y2009/V21/I3/347

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