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| PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY |
| ZHU Hou-fei1; HUANG Wen-quan2; YANG Chao3; HAO Long1; GAN Fu-xing1、4 |
1School of Resource and Environmental Science;Wuhan University;Wuhan 430079;
2Anhui Vocational & Technical College of Industry & Trade;Huainan 232001;
3Department of Environment Supervision;Zhejiang Province′s Environmental Protection Science Design and Research Institute;Hangzhou 310007; 4State Key Laboratory for Corrosion and Protection;Shenyang 110016 |
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Abstract The surface morphology and composition,microstructure,appearance,adhesion,hardness,antiabration ability,porosity ratio,solder ability and corrosion resistance of electroless Ni-P alloy plating on W-Cu alloy were investigated.The result indicates that the Ni-P alloy coating belongs to high phosphorus coating with P content 11.37 wt.% and it is amorphous in nature,and the anti-abrasion ability and hardness of W-Cu alloy was greatly improved by electroless Ni-P alloy plating.Meanwhile,the Ni-P alloy coating has a qualified adhesion with W-Cu alloy substrate with lower porosity ratio and good solderability and the deposit can offer fairly good protection to W-Cu alloy substrate in 3.5 wt.% NaCl solution,artificial sweat solut
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Received: 12 March 2007
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Corresponding Authors:
HAO Long
E-mail: fxgan@whu.edu.cn
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