Analysis of Creep Performance of Micro Solder Joints under Different Loading Mode

doi:10.11901/1005.3093.2018.124

Chinese Journal of Materials Research

2018, Vol. 32

Issue (3): 184-190 DOI: 10.11901/1005.3093.2018.124

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Analysis of Creep Performance of Micro Solder Joints under Different Loading Mode

Xiangxia KONG, Fenglian SUN(

), Miaosen YANG

School of Material Science and Engineering, Harbin University of Science and Technology,Harbin 150040, China;

Cite this article:

Xiangxia KONG, Fenglian SUN, Miaosen YANG. Analysis of Creep Performance of Micro Solder Joints under Different Loading Mode. Chinese Journal of Materials Research, 2018, 32(3): 184-190.

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Abstract

Creep behavior of the ball grid array (BGA) of lead-free solder joints of Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni (SACBN) was investigated via nanoindentation by step loading-unloading and single loading-unloading respectively. The results show that: for the two different test modes with the same load 60 mN and holding time 300 s, the creep displacement of solder joints by step loading-unloading is significantly less than that by single loading-unloading. However, the creep hardness for the former case is 1.87 times of that of the later one. The indentation creep decreased at three stages for the case of step loading-unloading, however the creep hardness increased. The creep exponent n was obtained by fitting calculation and found that the n value for the step loading-unloading is 1.31 times of that for single loading-unloading. The creep resistance performance of micro solder joints was improved by strain hardening during the process of step loading-unloading.

Key words: metallic materials nanoindentation micro solder joints creep resistance step loading-unloading stress index

Received: 07 September 2017

ZTFLH:

TG425

Fund: Supported by National Natural Science Foundation of China (No. 51174069)

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	Xiangxia KONG
	Fenglian SUN
	Miaosen YANG

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https://www.cjmr.org/EN/10.11901/1005.3093.2018.124 OR https://www.cjmr.org/EN/Y2018/V32/I3/184

Fig.1 Loading pattern for load - unload test mode

Fig.2 Loading pattern for step load- unload test mode

Fig.3 Overall microstructure of BGA solder joints after nanoindentation test

Fig.4 Typical indentation load-depth curve for solder alloy

Fig.5 Relation of creep deformation versus dwell time

Fig.6 Force-displacement curve of SACBN BGA solder joint under different load-unload method (a) Force-displacement curve of micro solder joint under step load-unloading test mode (b) Force-displacement curve of micro solder joint under single load-unloading test mode

Fig.7 Creep depth-time curve of SACBN BGA solder joint under different load-unload method (a) Creep depth-time curve of micro solder joint under step load-unloading test mode (b) Creep depth-time curve of micro solder joint under single load-unloading test mode

Fig.8 Expression of indentation creep

Table 1 The C_IT and creep hardness of micro solder joints under different loading mode

Fig.9 The

ln ε ˙ - lnH

relationship of Cu/SACBN/Cu by different load method (a) The

ln ε ˙ - lnH

relationship of micro solder joint under step load-unloading test mode (b) The

ln ε ˙ - lnH

relationship of micro solder joint under single load-unloading test mode

Table 2 The creep stress index of Cu/SACBN/Cu by different loading mode

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