Effect of Glass Powder on Performance of Copper Conductor Film Prepared via Sintering Cu-glass Paste

doi:10.11901/1005.3093.2016.553

Chinese Journal of Materials Research

2017, Vol. 31

Issue (6): 472-480 DOI: 10.11901/1005.3093.2016.553

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Effect of Glass Powder on Performance of Copper Conductor Film Prepared via Sintering Cu-glass Paste

Xiaoqiang MA¹,Xiaoyun ZHU¹(

),Jinming LONG²,Mei CAO³

1 School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China
2 Kunming Guixinkai Science and Technology Ltd, Kunming 650093, China
3 School of Science, Kunming University of Science and Technology, Kunming 650093, China

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Xiaoqiang MA,Xiaoyun ZHU,Jinming LONG,Mei CAO. Effect of Glass Powder on Performance of Copper Conductor Film Prepared via Sintering Cu-glass Paste. Chinese Journal of Materials Research, 2017, 31(6): 472-480.

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Abstract

Copper pastes with different glass powders were prepared and then printed on Al₂O₃ substrate and finally sintered at 850℃ to produce Cu film on the Al₂O₃ substrate surface. The produced Cu-films and glass powder were characterized by means of metallographic microscope, X-ray diffractometer, scanning electron microscope and thermo gravimetric analyzer. While the effect glass powder on the conductivity and adhesive performance of Cu films was also assessed. The results show that glass powder G3 composited of SiO₂-B₂O₃-ZnO possesses appropriate transition temperature, with which a compact copper film with flat surface and good electrical conductivity can easy be made. When the Cu-paste with 4.8 mass% of glass powder G3, the produced Cu-film presents electrical resistance of 9.5 mΩ/□ and adhesive strength of 24 N/mm² to the Al₂O₃ substrate. In order to verify the reliability of Cu-film in service, the oxidation resistance and aging properties of Cu-film G3-3 were examined. It was found that the average mass gain rate of the Cu-film was 3.5% after 28 days oxidation at room temperature, the resistance change average rate was 0.79%. After aging test at 20~160^oC for 12 h, the average change rate of the Cu-film resistance was 12.63% and the average mass gain rate was 4.63%, which demonstrated that film has the good oxidation resistance and anti-aging performance.

Key words: composite glass powder copper film sheet resistance adhesion reliability

Received: 22 September 2016

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	Xiaoqiang MA
	Xiaoyun ZHU
	Jinming LONG
	Mei CAO

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https://www.cjmr.org/EN/10.11901/1005.3093.2016.553 OR https://www.cjmr.org/EN/Y2017/V31/I6/472

Table 1 The copper powder performance

Table 2 The glass powder performance

Table 3 The organic vehicle formula

Table 4 The copper paste formula (%, mass fraction)

Fig.1 Sintered curve at 850℃ under nitrogen

Fig.2 Sintered copper film sample

Fig.3 XRD diffraction pattern of glass powder G1~G4

Fig.4 XRD diffraction pattern of copper film samples G1~G4

Fig.5 TG and DTG curves of glass powder G1 and G3

Fig.6 Metallographsic microscope photographs of copper film samples (a) G1-1,(b) G2-1,(c) G3-1,(d) G3-2,(e) G3-3,(f) G4-1

Fig.7 Surface SEM photographs of copper film samples (a) G1-1,(b) G2-1,(c) G3-1,(d) G3-2,(e) G3-3,(f) G4-1

Fig.8 Cross-section SEM photographs of copper film samples(a) G1-1,(b) G2-1,(c) G3-1,(d) G3-2,(e) G3-3,(f) G4-1

Fig.9 Copper film samples sheet resistance

Fig.10 The copper film samples adhesion

Fig.11 Late sintered copper film sample

Fig.12 Oxidation weight gain of copper films under ambient temperature

Table 5 The conductivity changes of copper film samples at room temperature environment

Table 6 The oxidation weight gain of copper film samples before and after high temperature aging test

Fig.13 Effect of high temperature aging on copper film samples conductivity

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