Preparation and Properties of High Density and High Coverage Silver-coated Copper Powder

doi:10.11901/1005.3093.2017.578

Chinese Journal of Materials Research

2018, Vol. 32

Issue (10): 775-781 DOI: 10.11901/1005.3093.2017.578

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Preparation and Properties of High Density and High Coverage Silver-coated Copper Powder

Bo WU¹, Xiaoyun ZHU¹(

), Mei CAO², Jinming LONG³

1 School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China
2 School of Science, Kunming University of Science and Technology, Kunming 650093, China
3 Kunming Guixinkai Science and Technology Ltd, Kunming 650093, China

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Bo WU, Xiaoyun ZHU, Mei CAO, Jinming LONG. Preparation and Properties of High Density and High Coverage Silver-coated Copper Powder. Chinese Journal of Materials Research, 2018, 32(10): 775-781.

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Abstract

Novel Ag-coatings of high density and high coverage were prepared on Cu-powders via composite electroless plating. Then the phase composition, surface morphology, oxidation resistance and electrical conductivity of the Ag-coated Cu-powder were characterized by means of X-ray diffractometer (XRD), scanning electron microscopy (SEM), high temperature oxidation test and digital ohmmeter respectively. The results show that when a proper amount of nano-Ag particulate was added to the plating electrolyte, the chemical deposition of Ag-coating of high density and high coverage can be facilitated on the surface of Cu-powder, besides,such nano-Ag particulate containing electrolyte presents better plating effect than that without adding nano-Ag particulate. Furthermore, the Ag-coated Cu- powder has good oxidation resistance and electrical conductivity.

Key words: composite silver-coated copper powder composite electroless plating high density high coverage

Received: 29 September 2017

ZTFLH:

TG146

Fund: Supported by Yunnan Province Science and Technology Innovation of Small and Medium-sized Enterprises Funded Projects (No. 2017EH016), Kunming University of Science and Technology Analysis and Testing Funds (No. 2016M20152230070)

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	Bo WU
	Xiaoyun ZHU
	Mei CAO
	Jinming LONG

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https://www.cjmr.org/EN/10.11901/1005.3093.2017.578 OR https://www.cjmr.org/EN/Y2018/V32/I10/775

Fig.1 Preparation process and test flow chart of silver-coated copper powder

Fig.2 SEM images of silver-coated copper powder with different amounts of nano silver (a) 0 g/L, (b)1 g/L, (c) 2 g/L and (d) 3 g/L

Fig.3 Distribution of line scanning elements of silver-coated copper powder (a) Backscattered electron image of silver-coated copper powder cross section, (b) Element distribution image of the line scan

Fig.4 SEM images of silver-coated copper powder coating (a) No added nano silver, (b) Added nano silver

Fig.5 Physical growth model of silver-coated copper powder silver coating (a) No added nano silver, (b) Added nano silver

Fig.6 XRD patterns of silver-coated copper powder

Table 1 Intensity ratio of characteristic peaks of silver-coated copper powder

Fig.7 Diagram of the deposition process of the coating

Fig.8 Diagram of the coating effect of the coating

Fig.9 SEM image of composite electroless silver-coated copper powder with different silver content (a) 10%, (b) 30% and (c) 50%

Table 2 Oxidation resistance of silver-coated copper powder

Fig.10 Electrical conductivity of copper-coated copper powder

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