Curing Behavior of Epoxy Resin Packaging Material Based on FBG Online Monitoring Technique

doi:10.11901/1005.3093.2017.551

Chinese Journal of Materials Research

2018, Vol. 32

Issue (10): 737-742 DOI: 10.11901/1005.3093.2017.551

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Curing Behavior of Epoxy Resin Packaging Material Based on FBG Online Monitoring Technique

Linlin GAO¹, Leida ZHANG¹, Qinglin WANG¹, Hui YE¹, Guoshun WAN¹, Mingshun JIANG², Yuxi JIA¹(

)

1 School of Materials Science and Engineering, Shandong University, Jinan 250061, China
2 School of Control Science and Engineering, Shandong University, Jinan 250061, China

Cite this article:

Linlin GAO, Leida ZHANG, Qinglin WANG, Hui YE, Guoshun WAN, Mingshun JIANG, Yuxi JIA. Curing Behavior of Epoxy Resin Packaging Material Based on FBG Online Monitoring Technique. Chinese Journal of Materials Research, 2018, 32(10): 737-742.

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Abstract

During curing process, the temperature and strain of liquid epoxy resin, which was used for electronic packaging, were online monitored by fiber Bragg grating (FBG) sensors. The evolution of the temperature and strain with the curing time was measured by FBG sensors in the same mould for various desired spots, where locate at the same height but different positions. Besides, under the same experimental condition, the effect of the epoxy resin dosage on the temperature- and strain-evolution was also examined. The results show that during the curing process, the strain-time and the temperature-time curves for the epoxy resin at the same height but different positions have good consistency, which means that the temperature and strain responses during the curing process of the epoxy resin are independent of the horizontal position. In addition, for fixed embedded positions of FBG sensors, both of the maximum temperature during the curing process and the final residual strain after curing increase with the increasing dosage of epoxy resin.

Key words: polymer materials epoxy resin FBG online monitoring curing reaction electronic packaging

Received: 18 September 2017

ZTFLH:

TB324

Fund: Supported by National Natural Science Foundation of China (No. 51373090), National Defense Basic Scientific Research (No. JCKY2016205B007), Ministry of Industry and Information Technology for Civil Aircraft Industry (No. MJ-2015-H-G-103), and Fundamental Research Funds of Shandong University (No. 2016JC012)

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	Linlin GAO
	Leida ZHANG
	Qinglin WANG
	Hui YE
	Guoshun WAN
	Mingshun JIANG
	Yuxi JIA

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https://www.cjmr.org/EN/10.11901/1005.3093.2017.551 OR https://www.cjmr.org/EN/Y2018/V32/I10/737

Fig.1 Packaging structure of FBG sensors (a) FBG temperature sensor (b) FBG strain sensor

Fig.2 Lay-up schematic of FBG sensors (a) Group A; (b) Group B

Table 1 Experimental parameters of FBG sensors

Fig.3 Reflection spectrum of FBG sensors (a) FBG temperature sensors; (b) FBG strain sensors

Fig.4 Temperature and strain curves evolving with time measured by FBG1 and FBG3 (a) Temperature-time curves of FBG1T and FBG3T; (b) Strain-time curves of FBG1S and FBG3S

Fig.5 Temperature and strain curves evolving with time measured by FBG3

Fig.6 Temperature and strain curves evolving with time measured by FBG1 and FBG2 (a) Temperature-time curves of FBG1T and FBG2T; (b) Strain-time curves of FBG1S and FBG2S

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