Research Progress on Effect of Length Scale on Electrical Resistivity of Metals

doi:10.11901/1005.3093.2013.365

Chinese Journal of Materials Research

2014, Vol. 28

Issue (2): 81-87 DOI: 10.11901/1005.3093.2013.365

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Research Progress on Effect of Length Scale on Electrical Resistivity of Metals

Guangping ZHANG^1,^**(

),Menglin LI¹,Ximao WU²,Chunhe LI²,Xuemei LUO¹

1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, ChineseAcademy of Sciences, Shenyang 110016
2. Northeast Electric Power Research Institute, Liaoning Electric Co., LTD, Shenyang 110006

Cite this article:

Guangping ZHANG,Menglin LI,Ximao WU,Chunhe LI,Xuemei LUO. Research Progress on Effect of Length Scale on Electrical Resistivity of Metals. Chinese Journal of Materials Research, 2014, 28(2): 81-87.

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Abstract

With the development of micro/nano-technologies, microstructural scales or geometrical dimensions of metal conductors in the micro/nano-devices are becoming shrunk from macroscopic scale to micron scale, submicron scale and even nanometer scale, leading to the fact that the electrical resistivity of metal conductors at room temperature tends to exhibit evident size effects. Recent studies on the electrical resistivity of metal conductors at different length scales were reviewed in this paper, focusing on the effects of the geometrical scales of microscalematerials and of the scale of microstructures and defects in the materials as well as the relevant theoretical models. Finally the developing tendency of the investigations on the electrical resistivity of metal conductors and the service reliability of the microscale metals in the future are also addressed.

Key words: foundational discipline in materials science electrical resistivity reviews size effect microstructure microscale

Received: 31 May 2013

Fund: *Supported by the 2012 Scientific Project of National Grid Corporation of China and the National High Technology Research and Development Program of China No. 2010CB631003.

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	Guangping ZHANG
	Menglin LI
	Ximao WU
	Chunhe LI
	Xuemei LUO

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https://www.cjmr.org/EN/10.11901/1005.3093.2013.365 OR https://www.cjmr.org/EN/Y2014/V28/I2/81

Fig.1 Variation of resistivity and electrical conductivity of commercial pure Cu with respect to differentARB process cycles^[30]

Fig.2 Schematic illustration of effects on electrical resistivity of metals

Fig.3 Electrical resistivity as a function of thickness of Al, Au and Cu films^[39]

Fig.4 Electrical resistivity as a function of individual layer thickness of Cu/Ta multilayers (a) and variation of the resistivity of Cu/Ta multilayers measured experimentally and predicted in termsof the F-S, M-S and the new FS-MS combined models^[26] (b)

Fig.5 Relationship between electrical conductivity and length scale of pure copper

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