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金掺杂降低碳纳米管接触电阻的实验研究 |
刁加加1, 常春蕊2(), 张志明3, 张好强1, 孙红婵1, 安立宝1() |
1 华北理工大学机械工程学院 唐山 063009 2 华北理工大学理学院 唐山 063009 3 华北理工大学材料科学与工程学院 唐山 063009 |
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Reducin g Contact Resistance of Carbon Nanotubes by Au Doping |
Jiajia DIAO1, Chunrui CHANG2(), Zhiming ZHANG3, Haoqiang ZHANG1, Hongchan SUN1, Libao AN1() |
1 College of Mechanical Engineering, North China University of Science and Technology, Tangshan 063009, China 2 College of Science, North China University of Science and Technology, Tangshan 063009, China 3 College of Materials Science and Engineering, North China University of Science and Technology, Tangshan 063009, China |
引用本文:
刁加加, 常春蕊, 张志明, 张好强, 孙红婵, 安立宝. 金掺杂降低碳纳米管接触电阻的实验研究[J]. 材料研究学报, 2017, 31(7): 511-517.
Jiajia DIAO,
Chunrui CHANG,
Zhiming ZHANG,
Haoqiang ZHANG,
Hongchan SUN,
Libao AN.
Reducin g Contact Resistance of Carbon Nanotubes by Au Doping[J]. Chinese Journal of Materials Research, 2017, 31(7): 511-517.
[1] | Meng T, Wang C Y, Wang S Y.First-principles study of contact between Ti surface and semiconducting carbon nanotube[J]. Journal of Applied Physics, 2007, 102(1): 013709-1 | [2] | Nemec N, Tománek D, Cuniberti G.Contact dependence of carrier injection in carbon nanotubes: an ab initio study[J]. Physical Review Letters, 2006, 96(7): 076802-1 | [3] | Tan M, Ye X, Wang X, et al.Improving contact of CNT-metal by annealing[J]. Journal of Functional Materials and Devices, 2008, 14(1): 227 | [4] | Asaka K, Karita M, Saito Y.Modification of interface structure and contact resistance between a carbon nanotube and a gold electrode by local melting[J]. Applied Surface Science, 2011, 257(7): 2850 | [5] | Chen C, Yan L, Kong E S, et al.Ultrasonic nanowelding of carbon nanotubes to metal electrodes[J]. Nanotechnology, 2006, 17(9): 2192 | [6] | Madsen D N, M?lhave K, Mateiu R, et al.Soldering of nanotubes onto microelectrodes[J]. Nano Letters, 2003, 3(1): 47 | [7] | Song X.Study on mechanism of carbon nanotube/metal interfacial bonding and related technology [D].Shanghai: Shanghai Jiao Tong University, 2010(宋晓辉. 碳纳米管/金属界面键合机制及其相关技术研究 [D]. 上海: 上海交通大学, 2010) | [8] | Liu E K, Zhu B S, Luo J S, The Physics of Semiconductors (7th Edition) [M]. Beijing: Publishing House of Electronics Industry, 2011(刘恩科, 朱秉升, 罗晋生. 半导体物理学(第七版) [M]. 北京: 电子工业出版社, 2011) | [9] | Kong B S, Jung D H, Oh S K, et al.Single-walled carbon nanotube gold nanohybrids: application in highly effective transparent and conductive films[J]. The Journal of Physical Chemistry C, 2007, 111(23): 8377 | [10] | Kim K K, Bae J J, Park H K, et al.Fermi level engineering of single-walled carbon nanotubes by AuCl3 doping[J]. Journal of the American Chemical Society, 2008, 130(38): 12757 | [11] | Kim S, Kulkarni D D, Rykaczewski K, et al.Fabrication of an ultralow-resistance ohmic contact to MWCNT - metal interconnect using graphitic carbon by electron beam-induced deposition (EBID)[J]. IEEE Transactions on Nanotechnology, 2012, 11(6):1223 | [12] | Tian C H.Catalyst performance of Pt-Sn/MWCNTs (modified) on the dehydrogenation of propane [D]. Shanghai: Shanghai Normal University, 2014(田春华. 多壁碳纳米管改性负载铂锡在丙烷脱氢反应中催化性能的研究 [D]. 上海: 上海师范大学, 2014) | [13] | Skákalová V, Kaiser A B, Dettlaff-Weglikowska U, et al.Effect of chemical treatment on electrical conductivity, infrared absorption, and Raman spectra of single-walled carbon nanotubes[J]. The Journal of Physical Chemistry B, 2005, 109(15): 7174 | [14] | Rao A M, Eklund P C, Bandow S, et al.Evidence for charge transfer in doped carbon nanotube bundles from Raman scattering[J]. Nature, 1997, 388(6639): 257 | [15] | Lim S C, Jiang J H, Bae D J, et al.Contact resistance between metal an d carbon nanotube interconnects: effect of work function and wettability[J]. Applied Physics Letters, 2009, 95(26): 264103-1 |
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